QIANLI Bumblebee Stencil (QS689) for iPhone 16 Series

The QIANLI Bumblebee Stencil (QS689) is a high-precision reballing stencil, specially designed for the motherboards of iPhones in the 16 series. This tool is essential for micro-soldering technicians, ensuring exact alignment and uniform application of solder paste during repair operations.

Extended Compatibility:

• Supported Models: iPhone 16, 16 Plus, 16 Pro, 16 Pro Max.
• Applications: Reballing of critical components such as CPU, NAND, PMIC, and other essential elements of iPhone 16 series motherboards.

Technical Features:

• Premium Material: Made of durable stainless steel, resistant to high temperatures and deformation, ensuring a long lifespan.
• Precision Laser Cut: Provides uniform distribution of solder paste and precise reballing of components, thanks to advanced laser cutting technology.
• Optimized Thickness: Ultra-thin design facilitates efficient heat transfer and precise reballing.
• Anti-Slip Design: Stabilizes components during the reballing process, minimizing the risk of alignment errors.

Benefits for Professionals:

• Time-saving: Speeds up micro-soldering operations by ensuring precise positioning of solder balls.
• Reliability and Durability: Material resistant to high temperatures, ensuring prolonged use of the stencil.
• Absolute Precision: High-precision laser cutting allows optimal alignment of solder balls, essential for delicate repairs.

The QIANLI Bumblebee Stencil (QS689) is an essential tool for repair professionals looking to ensure quick and precise interventions on iPhone 16 series motherboards. Its robust design and unmatched precision make it a top choice for any specialized repair workshop.