QIANLI Bumblebee Stencil (QS338) for iPhone 15 Series

The QIANLI Bumblebee Stencil (QS338) is a high-precision stencil designed for reballing the integrated circuits of iPhone 15 series motherboards. With its quality manufacturing and ultra-precise laser cutting, it ensures perfect alignment and optimal application of solder paste, making micro-soldering operations easier for specialized technicians.

Extended Compatibility:

• Supported Models: iPhone 15, 15 Plus, 15 Pro, 15 Pro Max.
• Applications: Reballing of CPU, NAND, PMIC, and other key components of iPhone 15 series motherboards.

Technical Features:

• High-quality stainless steel material: Resistant to high temperatures and deformations, ensuring long life and reliable use.
• Precision laser cutting: Ensures perfect alignment and uniform solder paste deposition for effective repair.
• Optimized thickness: Ultra-thin stencil promoting uniform heat transfer for precise and fast reballing.
• Non-slip design: Provides increased stability during soldering operations, reducing alignment errors.

Benefits for Professionals:

• Repair process optimization: Speeds up micro-soldering interventions by ensuring precise positioning of solder balls.
• Reliability and durability: Designed to withstand high temperatures and intensive use.
• Maximum precision: Thanks to advanced laser cutting, it allows for clean and burr-free reballing, essential for sensitive components.

The QIANLI Bumblebee Stencil (QS338) is an essential tool for technicians specializing in repairing iPhone 15 series motherboards. Its premium design and exceptional precision guarantee quick and effective repairs, meeting the requirements of professional workshops.