QIANLI Bumblebee Stencil (QS209) - iPhone 14 Series

Description

The QIANLI Bumblebee QS209 stencil is a professional reballing template specially designed for the iPhone 14 Series models (14 / 14 Plus / 14 Pro / 14 Pro Max). It allows for the precise repositioning of solder balls on BGA chips during rework or component replacement operations on the motherboard. Made of high-quality stainless steel, this stencil ensures excellent heat resistance and optimal durability even under heavy use. Its ultra-precise cutting ensures perfect alignment of the balls and homogeneous distribution, essential for reliable and reproducible reballing on the latest generation chips.

Technical Specifications

• Brand: QIANLI
• Model: Bumblebee Stencil - QS209
• Type: BGA reballing stencil
• Compatibility: iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max
• Use: Repositioning of solder balls on BGA chips
• Material: High-precision stainless steel
• Thickness: Optimized for homogeneous ball deposition
• Cutting: High-precision laser engraving for exact alignment
• Heat resistance: Designed for use with hot air / infrared stations

Advantages

• Perfect alignment: Precise positioning of balls on BGA pads.
• High-precision cutting: Sharp laser engraving for homogeneous distribution.
• Durable material: Stainless steel resistant to high temperatures and deformations.
• Complete compatibility: Suitable for specific iPhone 14 Series chips.
• Professional tool: Designed for intensive use in micro-soldering workshops.

Recommended Applications

Ideal for technicians specialized in BGA rework, micro-soldering, and iPhone motherboard repair, especially on the iPhone 14 Series. An essential tool to ensure clean, precise reballing in line with professional technical requirements.

Package Contents

• 1 x QIANLI Bumblebee Stencil (QS209) - iPhone 14 Series