QIANLI Bumblebee Stencil (QS161) for iPhone 13 Series

The QIANLI Bumblebee Stencil (QS161) is a high-precision stencil designed for the repair and reballing of integrated circuits on the motherboards of iPhone 13 series. This tool is essential for technicians specialized in micro-soldering, ensuring perfect alignment and effective application of solder paste.

Extended Compatibility:

• Supported Models: iPhone 13, 13 Mini, 13 Pro, 13 Pro Max.
• Applications: Reballing of CPU, NAND, PMIC, and other essential components on the motherboards of iPhone 13 series.

Technical Features:

• High-Quality Material: Made of durable stainless steel, heat and deformation resistant, ensuring prolonged use.
• Micrometric Precision: Advanced laser cutting ensuring uniform distribution of solder paste and precise reballing of components.
• Optimized Thickness: Ultra-thin design facilitating precise reballing while ensuring uniform heat transfer.
• Anti-Slip Design: Stabilizes components during reballing to minimize alignment errors.

Advantages for Professionals:

• Time-Saving: Speeds up micro-soldering operations by offering precise positioning of solder balls.
• Reliability and Durability: Material resistant to high temperatures, ensuring a long stencil lifespan.
• Absolute Precision: High-precision laser cutting for optimal alignment of solder balls.

The QIANLI Bumblebee Stencil (QS161) is an essential tool for professional repairers looking to ensure quick and precise interventions on the motherboards of iPhone 13 series. Its robust design and unmatched precision make it a top choice for any specialized repair workshop.