MECHANIC MagTin Max - Double-Sided Magnetic BGA Reballing Platform

Description

The MECHANIC MagTin Max is the ultimate solution for high-precision reballing operations. This magnetic station revolutionises the way solder balls are redone on BGA chips (CPU, NAND, GPU). Thanks to its double-sided magnetic base, it ensures perfect plating of the stencil onto the chip, eliminating any empty space where solder paste could seep in. This thermal and mechanical stability is the key to obtaining uniform-sized balls and avoiding solder bridges under components.

Designed to last, the platform combines aeronautical aluminium and insulating synthetic stone to protect your workbench while keeping heat localised on the component. Its universal positioning system and ultra-thin stencils allow for work on the most complex iPhone and Android chips with a professional success rate. The MagTin Max transforms a delicate task into a smooth, clean, and reproducible process.

Technical Specifications

• Reference: MagTin Max
• System: Magnetic fixation via integrated magnets
• Structure: Double-sided for increased versatility (CPU/NAND/IC)
• Materials: Aluminium alloy and synthetic stone resistant to 500°C
• Stencils: High-precision stainless steel (laser cut)
• Advantages: Automatic alignment, anti-deformation, time-saving
• Usage: Advanced micro-soldering, motherboard swaps, chip repair

Workshop Advice & Usage

For perfect reballing with the MagTin Max, ensure the chip is completely cleared of old solder residue and is perfectly degreased. Place the chip in the dedicated slot, place the magnetic stencil which will align almost by itself, then apply a quality solder paste (type 183°C or 138°C as appropriate). Pro tip: Wipe off excess paste with a lint-free paper before heating. Use a wide hot air nozzle at approximately 330°C with moderate airflow to prevent the balls from "jumping" out of their slots during melting.