APU Heat Sink for Nintendo Switch

Description

The APU heat sink is a heat-conducting metal element located on the main processor (APU) of the Nintendo Switch. It efficiently distributes and dissipates the heat generated by the processor to the ventilation system, thus avoiding any overheating. In case of overheating, noisy console, or after motherboard replacement, this component is essential to ensure the thermal stability of the system.

Technical Specifications

• Type: Passive metal heat sink (APU radiator)
• Compatibility: Nintendo Switch - standard model HAC-001 / HAC-001(-01)
• Function: heat transfer between the APU (CPU/GPU) and the heat pipe / fan
• Mounting: direct screwing on the motherboard via plate and thermal paste
• Associated components: fan, heat pipe, central chassis

Advantages

• Prevents processor overheating risks
• Essential for the proper functioning of the console during intensive gaming
• Compatible with the original cooling system
• Easy installation for technicians or experienced users
• Helps extend the lifespan of internal components