High Temperature Polyimide Adhesive Tape (20mm x 22m) - Electronic Grade

Description

The high temperature polyimide tape is an essential passive protection tool for any precision micro-soldering operation. In the context of motherboard repair, it serves as a thermal barrier to isolate sensitive components located on the periphery of an intervention area. Its ability to withstand extreme temperatures without adhesive residue transfer makes it the industry standard for masking plastic connectors, fragile ribbons, and integrated circuits when using a hot air station.

Its 20mm width offers a perfect balance between coverage and precision. It secures small passive components (resistors and capacitors) to prevent them from "flying" under the pressure of hot air, while providing an amber transparency that allows the technician to keep an eye on the visual markers of the motherboard. Apart from soldering, this tape is also used as a high-performance permanent insulator to cover track repairs (jumpers) or to protect circuits against moisture and internal short circuits.

Technical Specifications

• Material: High-density Polyimide Film
• Adhesive Type: Silicone (High heat resistance)
• Width: 20 mm
• Length: 22 meters
• Thermal Resistance: 260°C (continuous) / 300°C (short exposure)
• Thickness: 0.05 mm
• Properties: Anti-static, electrical insulator, solvent resistant

Workshop & Usage Advice

For increased thermal protection when desoldering a processor (CPU) or NAND memory, we recommend applying a first layer of polyimide tape, followed by a layer of aluminum adhesive tape. The polyimide ensures basic electrical and thermal insulation, while the aluminum reflects the infrared heat outward. When removing the tape, wait for the board to return to room temperature to avoid any mechanical stress on components still weakened by heat.