2UUL SolderMelt (SC20) - CPU Pad Cleaner and Solder Remover

Technical Description

The 2UUL SolderMelt (SC20) is a high-performance cleaning agent designed to simplify the most critical step in micro-soldering: pad preparation after removing a BGA component. Its unique formula acts directly on solder remains (especially hardened or oxidised residues) to make them more malleable. It allows for perfectly flat and clean surfaces on processors (CPUs) and memory chips, ensuring surgical precision during reballing.

Using the SC20 helps limit the intensive use of desoldering braid and high-temperature soldering irons. By protecting the physical integrity of the printed circuit board, it becomes an essential tool for complex repairs on smartphone and computer motherboards, where the slightest error on a pad can render the device irreparable.

Technical Specifications

• Reference: 2UUL SC20 (SolderMelt)
• Application: Pad cleaning after CPU, NAND, IC desoldering
• Function: Solder softening and surface deoxidation
• Compatibility: All types of alloys (leaded or lead-free)
• Packaging: Bottle with precision applicator
• Usage: Professional micro-soldering

Benefits

• Pad Safety: Significantly reduces mechanical stress on copper pads, preventing accidental lifting during