2UUL MicroFix (BL01) - Pack of 4 Precision Blades for PCB Cleaning

Technical Description

The 2UUL MicroFix (BL01) pack is a set of 4 interchangeable blades specifically developed for surgical-level interventions on printed circuit boards. Unlike standard scalpels, these blades feature "hook" and miniature spatula shapes, optimised to slide under epoxy resin residues (underfill) and clean the edges of IC chips after desoldering. They are the preferred tool for preparing a motherboard before high-precision reballing.

Each blade is forged from high-quality stainless steel, ensuring perfect rigidity and heat resistance. Their design allows for the removal of impurities, structural adhesives, and solder bridges with controlled force, thus minimising the risk of scratching the protective varnish (solder mask) or tearing fragile tracks.

Technical Specifications

• Reference: 2UUL BL01 (MicroFix Series)
• Contents: Set of 4 blades with various profiles (hooks and bevels)
• Material: High-performance stainless steel
• Compatibility: Compatible with most standard scalpel handles (including the 2UUL Vajra DA29)
• Usage: Underfill removal, black glue cleaning, CPU de-resining
• Precision: Manually sharpened edges for a clean cut

Key Benefits

• Versatility of Shapes: The 4 different profiles allow for the treatment of all types of resins, from the softest to the hardest, in all directions.
• Access to Dense Areas: The thinness of the tips allows for cleaning between SMD capacitors and resistors without displacing them.
• Edge Durability: The treated steel maintains its sharpness even after multiple uses on abrasive materials.
• Circuit Safety: Shapes designed to scrape parallel to the board, thus avoiding accidental gouging into the copper.
• Professional Standard: An essential for Level 3 repairs (micro-soldering) on iPhones and high-end Android smartphones.

Workshop Tip: For optimal resin removal, slightly heat the area with hot air (approximately 150°C-200°C depending on the type of glue) before using the MicroFix hook blade. This softens the underfill and allows the blade to glide effortlessly, protecting the integrity of the motherboard pads.